The following is excerpted from the question-and-answer section of the transcript.
(Questions from industry analysts are provided in full, but answers are omitted - download the transcript to see the full question-and-answer session)
Question: Laura Chen - Citi - Analyst
: Thank you. Thank you Mr Cheung for your very comprehensive presentation. You have any questions online. So the question will only be taken by
text. So you can type your questions in the Q&A box. Mr Cheung and also we have the ASE IR team with us would answer the questions and while
we are waiting for the online questions here, maybe I can uh ask some technical questions first.
I know that's very technical but just wondering that when you talk about the EIC and also the PIC packaging. Mr Cheung, you mentioned that they
are a different type of packaging techniques including chip and waiver and also the (inaudible) and even like optical interposer. So I'm just wondering
that how ASE would cooperates with your funding partners and also your customers in this type of different techniques for the CPO design?
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SEPTEMBER 25, 2024 / 2:00AM, C.N - ASE Technology Holding Co Ltd Advanced Package Development in
AI Arena, Power and Optics Trend Expert Call Hosted By Citi
Question: Laura Chen - Citi - Analyst
: Thank you. And also since you are on the R&D side from your current observation and also the engineering work, do you think it's time for CPO to
becoming more mature anytime soon? Or do you think it still takes some time to get more mature?
Question: Laura Chen - Citi - Analyst
: Okay. Thank you. I think we have a few questions coming up, first of all, I came to know that what's the current bottleneck for the CPO yield? You
mentioned about the problem. Can you elaborate more and also from the supply chain perspective? Well, that the all set makers to become to
take the roles from the existing, optical module makers. What would be the implication to the supply chain?
Question: Laura Chen - Citi - Analyst
: Thank you, Ken. And also, yeah, another question, I just address is that, what will be the role of the existing optical module makers in the arena of
the CPO?
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SEPTEMBER 25, 2024 / 2:00AM, C.N - ASE Technology Holding Co Ltd Advanced Package Development in
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Unidentified Company Representative
I think in the larger scheme of things, each manufacturer will have certain skills and capabilities that they will focus on with the OS players. I think,
you know, given that these products are getting finer in their overall production in terms of the line in space and in terms of the, the top uh the
accuracy requirements, there are certain features or certain opportunities that would be more aligned to what we can do. I think that's not to take
away from other contract manufacturers, but they will continue to have their particular skill sets in whatever gets manufactured relative to CPO.
Question: Laura Chen - Citi - Analyst
: Thank you, Ken. Another question I may have is that um uh Calvin, you also mentioned about the power safety, voltage regulator module incorporated
with the advanced packaging. So I'm just wondering how does it work together with current majority of the AI chips in the (inaudible) packaging?
So it's just a kind of a one more step or how would that integrate into the current COs process.
Question: Laura Chen - Citi - Analyst
: Okay. So it sounds like it's more on the on substrate process, right? Is that correct?
Question: Laura Chen - Citi - Analyst
: Okay. Thank you. Another question coming on the line is that since there's still some uncertainty and the size of the CPO investment, we all set to
take a second line adapter approach before, like in the chiplet area.
Unidentified Company Representative
I think that the context of what CPO is. Again, each manufacturer, whether it's boundary contract, manufacturing or Oseps specific areas or specific
thick fineness that are key to what we do. The divisions of labor or the developments of technologies do go across all of these uh manufacturers.
Uh And in time, we will work together to create the ultimate solution or what would be a more standardized solution in the future.
Historically ASE has been a little bit more laid back in terms of letting those the leading edge get developed before there is a mass production
standard. So, for us, I think that that creates the generally the best return profile. But this is the involvement of all of the players uh continues to be
the case that including CPO at this time.
Question: Laura Chen - Citi - Analyst
: Okay, thank you very much. I think it's about time. So I really appreciate uh Calvin and also the whole IR teams came here to give a comprehensive
presentation and the Q&A section. And thank you, everyone so for your participant today.
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SEPTEMBER 25, 2024 / 2:00AM, C.N - ASE Technology Holding Co Ltd Advanced Package Development in
AI Arena, Power and Optics Trend Expert Call Hosted By Citi
Unidentified Company Representative
Thank everyone. Thanks Calvin.
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