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Shinko Electric Industries Co., Ltd.

80, Oshimada-machi
Nagano-shi 381-2287
Japan
Tel: 81/262/83-1000
URL: http://www.shinko.co.jp
Primary Symbols & Exchanges:
6967 - Tokyo
Primary Industry:
Semiconductors
SIC Industry Code:
NAICS Industry Code:
Thomson Financial Business Description:
The Group's principal activity is to develop, manufacture and market semiconductor packages. The operations are carried out through the following divisions: IC lead frames; IC packages; Airtight parts and Other. IC lead frames segment includes lead frames and IC assembly. IC packages include plastic laminate packages (PLP), ceramic packages and IC assembly. Airtight parts include glass terminals and arrestors. The group is also involved in manufacturing and sales of Plastic Laminated Package (PLP), Tape BGA, Lead frame, Glass-to-metal Seals, Optoelectronics Package, Pre-mold package, Precision Contact Parts, Arrester. IC Assembly, Multi Chip Package (MCP), Wafer Level Package (WLP) and System Module.
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