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STATS ChipPAC Ltd.

5 Yishun Street 23
Singapore 768442
Singapore
Tel: 65/6755-5885
URL: http://www.statschippac.com
Formerly known as:
ST Assembly Test Services Ltd.
Primary Symbols & Exchanges:
S24 - Singapore
Primary Industry:
Energy
SIC Industry Code:
NAICS Industry Code:
Mergers & Acquisitions:
STATS ChipPAC Ltd. Mergers and Acquisitions
Thomson Financial Business Description:
The Group's principal activities are providing packaging services, test services, and pre-production and post-production services. Packaging services include packaging solutions and full backend turnkey, redistribution and wafer bumping services as well as package design, electrical, mechanical and thermal simulation, and measurement and design of lead-frames and substrates. Test services include wafer probe and final testing, burn-in process support, reliability testing, thermal and electrical characterization, and dry pack and tape and reel tests. Pre-production and post-production services include package development, test software and related hardware development, warehousing and drop shipment services. The Group operates in Singapore, South Korea, China, Malaysia,Taiwan, and the United States.
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