The Group's principal activity is the development, manufacture and distribution of plasma systems for industrial applications. Plasma systems are used for precision cleaning of silicon wafers in chip production and chip assembly and activation of plastic material and to produce ultra fine drill holes in the production of printed circuit boards. The Group's Semiconductor Technology Division specialises in all vital processes involved in chip production - ranging from surface activation of the chip substrates to final cleaning and packaging of the plasma-treated chips. The Group's Surface Technology Division provides solutions for surface activation and micro-cleaning operations. PCB Technology - the Group's third segment - specialises in drill hole cleaning, dry-etching and ashing of printed circuit boards.
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