The Company's principal activity is providing bonding wires for semiconductors. Products include Gold Bonding Wires for connecting materials between silicon chips and lead frames; Gold Evaporation Materials for forming film for silicon wafters; Gold Sputtering Targets for forming conductivity films for semiconductor wafers and for forming gold films on the surface of jewellery and Solder Balls which are ball shaped electrical parts used to transmit electrical signals and as adhesive for semiconductor chips and circuit modules and printed circuit board cards.
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