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Thomson Financial Business Description:
| The Group's principal activity is to design, manufacture, market and service semiconductor processing equipment used in the fabrication of integrated circuits. The Group's etch and chemical mechanical planarization (CMP) products selectively remove portions of various films from the wafer to create semiconductors. The Group also develops intellectual property (IP) for integrated processing solutions. The Etch processes are required to manufacture every type of semiconductor device. The chemical mechanical planarization products are used to planarize the surface of the wafer to prepare it for further processing. The Group operates in the United States, Europe, Asia Pacific, Korea and Japan. The Group acquired Bullen Ultrasonics Inc & Suzhou Co Ltd in fis 2007. |
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