Kinsus Interconnect Technology Corp. Company Profile

Kinsus Interconnect Technology Corp.

1245, Jung Hua Rd.,
Hsinwu Hsiang
Taiwan
Taiwan
Tel: 34871919
URL: http://www.kinsus.com.tw/
Primary Symbol & Exchange:
3189 - Common Stock - Taiwan
Industry:
Electronic Components
+  SIC Industry Code:
+  NAICS Industry Code:
Thomson Financial Business Description:
The Group's principal activity is manufacturing ball grid array (BGA) boards. It is also engaged in wholesale and retail trade. Products include PBGA, CSP, cavity down, SiP, flip chip, COB and COF. Operations are carried out in Taiwan and other countries. The Group exports its products to Asia, the United States of America and Europe.
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