Chipbond Technology Corporation
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1-6, Li-Hsin Road I,
Science-Based Industrial Park
Hsin-Chu
Taiwan |
| Tel: |
886-3-5678788 |
| URL: |
http://www.chipbond.com.tw/ |
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| Primary Symbols & Exchanges: |
| 6147 - Taiwan |
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| Primary Industry: |
| Semiconductors |
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SIC Industry Code:
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NAICS Industry Code:
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Thomson Financial Business Description:
| The Company's principal activities are manufacturing, researching, developing and selling gold bump, solder bump, wafer bumping, tape carrier packaging, flip chip, chip on film, chip on glass and wafer level. Operations are carried out in Taiwan. The Company exports their products to Asia, Europe and The United States of America. |
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