CHIPBOND Technology Corporation is principally engaged in the research, development, manufacture and distribution of electronic and semiconductor products. The Company provides wafer bumping services, gold bumps, solder bumps, chip on glass (COG), chip on film (COF), flip chip and tape carrier packaging (TCP), among others. Its products are applied in the manufacture of computers, workstations, mobile phones, network products, air bag controllers, engine controlling components, automatic brake system (ABS), automobile air conditioners, digital cameras, watches and liquid crystal display (LCD) monitors, among others. The Company distributes its products primarily in Taiwan, Japan, Mainland China and other countries. On August 1, 2014, it merged with its wholly owned electronics subsidiary. After that, the wholly owned electronics subsidiary is dissolved.