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Thomson Financial Business Description:
| The Group's principal activities are packaging, manufacturing, assembling, processing, integrated testing and selling various integrated circuits. Other activities include manufacturing and selling of land grid array, FC substrate, IC frames, electronic parts and materials. Products dual in line, QUAD, ball-grid arrays (BGAs), pin grid arrays (PGAs), chip scale/size package (CSP), system in package (SiP), flip chip and Pb free solution. Operations are carried out in Taiwan, Asia and North America. The Group exports its products to Asia, the United States of America and other countries. |
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